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Four audio mix modules are used in the prototype mixer unit.  Figure
83 shows the silkscreen/assembly layer for this PC
board.  Table 6 shows the bill of materials for the
audio mix board.  Figures 84 and 85 show
the top and bottom routing layers for this board.
Note the presence of surface-mount components on the top routing
layer.
Figure 83:
Audio mix module PCB, silkscreen/assembly drawing.
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Table 6:
Audio Mix Module, bill of materials.
	 
| REFDES | 
QTY | 
DESCRIPTION | 
 
| R1 - R8 | 
8 | 
10K 1% metal film | 
 
| C1 - C10 | 
10 | 
0.1uF monolithic | 
 
| C11,C12 | 
2 | 
10uF electrolytic | 
 
| U1 - U4 | 
4 | 
SSM2163 (SOIC-28) | 
 
| U5 | 
1 | 
GAL16V8 | 
 
| U6 | 
1 | 
74LS373 | 
 
| U7 | 
1 | 
74LS04 | 
 
| J1 - J4, J7 - J9 | 
8 | 
16-pin DIP header | 
 
| J5 | 
1 | 
Molex Mini-Fit Jr. 8-circuit right angle | 
 
| J6 | 
1 | 
20-pin DIP header | 
 
 
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Figure 84:
Audio mix module PCB, component-side routing.
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Figure 85:
Audio mix module PCB, solder-side routing.
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 Next: Bus Combiner and Switcher
 Up: Mixer Unit
 Previous: Audio Input Module
     Contents 
Steve Richardson
2000-07-06
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Table of Contents
 
 
[Whole document in PDF 1.9MB]
 
 
[more photos and information]
 
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